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- Sn63/Pb37 Solder Paste 183C SMD BGA SMT Tin L...
Sn63/Pb37 Solder Paste 183C SMD BGA SMT Tin Lead No Clean | 50g no clean solder paste with tiny residue 183C melting point for SMD BGA IC chip and
SHP 31
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Composition for strong, reliable solder joints with excellent wetting.
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Product Description
Sn63/Pb37 Solder Paste 183C SMD BGA SMT Tin Lead No Clean | 50g no clean solder paste with tiny residue 183C melting point for SMD BGA IC chip and phone motherboard precision welding
Customer Questions & Answers
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Question:
What is the composition of the solder paste?
Answer: The solder paste contains 63% tin and 37% lead. -
Question:
What is the net weight of each can?
Answer: Each can contains 50g of solder paste. -
Question:
What are the primary applications for this solder paste?
Answer: It's used in circuit boards, motors, lighting, and various household and industrial appliances.
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SHP 31
Order now and get it around Sunday, September 13
This item is not restrict in my country.(Please click on above link if this item is not restrict in your country, So our team will review and allow.)
QTY:
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Features & Benefits
- Alloy content: 63% Tin / 37% Lead for optimal performance.
- Each can contains 50g of high-quality solder paste.
- Precise melting point of 183°C ensures quick and even melting.
- Minimizes thermal stress, making it ideal for sensitive components.
- Versatile applications across electronics, appliances, and industrial equipment.
- Perfect for maintenance and assembly of circuit boards and connectors.
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